Tresky Automation

TRESKY key strength:

• Quality “Made in Germany” – TRESKY develop, produce and sell Die Bonders from headquarters in Hennigsdorf, Germany.
• One Machine, unlimited bonding processes – All standard packaging technologies can be realized with one flexible machine. TRESKY has extensive experience with multi-chip module applications.
• Designed for tomorrow’s semiconductor needs – The semiconductor market leads the way for many other markets and is therefore constantly changing. Modular and flexible machine concept, combined with numerous innovative options, is enable TRESKY customers to react quickly to new technologies, product requirements and new market situations.
• Best bonding performance in the market – equipment is optimally matched to the customers’ requirements.
• Manual Mode – As a special feature, all machines offer a manual mode in which die bonding proto-type and R&D development can be carried out quickly and precisely without complex programming.
• From prototyping to production – Whether in the development of a prototype or in any process step that is important for the creation of a customized Die Bonder.